HELIOS NanoLab 460 F1

HELIOS NanoLab 460F1

Intro

The FEI Helios NanoLab 460F1 is a high advanced DualBeam platform for imaging, analysis, TEM sample- and AtomProbe Needle preparation, process development and process control laboratories. For this purposes, the FEI Helios NanoLab 460F1 combine the innovative Elstar with UC technology electron column for high-resolution and high material contrast imaging with the high-performance Tomahawk ion column for fast, precise sample preparation. The FEI Helios NanoLab 460F1 is additionally equipped with the MultiChem Gas Delivery System, the EasyLift Nanomanipulator, a cooling Trap, an IGT(Inert-Gas-Transfer)-Holder-Loadlock, a quick loader, a FlipStage 3, an EDX-System and an STEM III detector. This instrument is one of the few DualBeam Systems which combine an IGT-Holder-Loadlock with the possibility of a FlipStage 3 + EasyLift Nanomanipulator. Typical examples of use and technical specifications for the instrument are given below.

Instrument officers

Typical Applications and Limitations of Use

The configuration of the FEI Helios NanoLab 460F1 allows a variety of advanced imaging and prepa-ration techniques to be applied to wide bunch of solid state materials. These techniques include TEM sample preparation (normal- and backside milling) without breaking the vacuum (with Flipstage 3), STEM imaging on thin TEM samples with STEM 3 detector, Slice and view (automatic), Needle prepa-ration for tomography, AtomProbe sample preparation, plan-view preparation, lamellas on heating chips for TEM annealing experiments and with the IGT-Loadlock, even samples who are not allowed to supposed to air can be prepared on any previews way (except needle and AtomProbe preparation). The FEI Helios NanoLab 460F1 is not intended for the investigation of aqueous, ferromagnetic or organic samples without further discussions with both of the instruments officers and the ER-C general management.


Technical Specification

Microscope performance

  • electron landing voltage 20 V ... 30 kV
  • ion landing voltage 500 V … 30 kV
  • electron beam current ≤ 0.1 µA
  • ion beam current ≤ 65 nA
  • electron source Schottky thermal field emitter
  • resolution optimal WD(SEM) @ 2 … 15 kV < 0.6 nm
  • resolution optimal WD(SEM) @ 1 kV < 0.7 nm
  • resolution optimal WD (SEM) @ 200 V with beam deceleration < 1.5 nm
  • resolution (STEM) < 0.6 nm
  • ion source Gallium liquid metal
  • resolution (FIB) @ 30 kV < 4 nm
  • resolution (EDX) < 30 nm

Detectors

  • ETD – Everhart Thornley detector
  • TLD – through-the-lens detector
  • ICE – in-chamber electron
  • ICD – in-column detector
  • STEM 3+ - STEM detector (BF, DF, HAADF)
  • MD – mirror detector
  • CBS – retractable backscatter detector
  • CCD – charge-coupled detector
  • Nav-Cam – in-chamber navigation camera

Specimen Stages

  • Flipstage 3 with in situ STEM 3 detector
  • 5 axis all piezo motorized
  • 100 mm XY motion
  • IGT-Loadlock
  • Quick Loader

MultiChem Gas Delivery System

  • Pt, C, W for deposition
  • TEOS for insulator deposition
  • H2O etching gas

EDX System

  • TEAM software for measurement and analyses
  • “Octane Super” Detector
  • Active Area: 60mm²

Location

Building: 05.2
Room: xxxx
Phone: +49 2461 61 2403

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